This item is in: Engineering > Welding technologies
Microjoining and nanojoiningEdited by Y N Zhou, University of Waterloo, Canada
Woodhead Publishing Series in Welding and Other Joining Technologies No. 61
- reviews the basics of nanojoining including solid-state bonding and fusion microwelding
- covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling
- examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
- a valuable reference for production engineers, designers and researchers
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.
Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.
This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering.
ISBN 1 84569 179 2
ISBN-13: 978 1 84569 179 0
March 2008
832 pages 234 x 156mm hardback
£200.00 / US$340.00 / €240.00
Usually dispatched within 24 hours
About the editor
Y (Norman) Zhou is the Canadian Research Council (CRC) Chair in Microjoining and Professor of mechanical and mechatronics engineering at the University of Waterloo, Canada. His research on microwelding and joining is advancing the frontiers of knowledge in this field and making significant contributions to the increased miniaturization of micro-devices and micro-systems.
Titles which may also be of interest:
Nanolithography and patterning techniques in microelectronics
Handbook of laser welding technologies
Advances in brazing
Contents
PART 1 BASICS OF MICROJOINING
PART 2 MICROJOINING AND NANOJOINING PROCESSES
PART 3 MICROJOINING OF MATERIALS AND APPLICATIONS OF MICROJOINING
PART 1 BASICS OF MICROJOINING
Mechanisms of solid-state bonding
J E Gould, Edison Welding Institute, USA
- Introduction
- Mechanisms of solid-state bonding
- Contaminant displacement/interatomic bonding
- Extension of the contacting surfaces
- Separation of the contaminated areas
- Realignment of the grain structures for bonding
- Breakdown of the interfacial structure
- Summary
- References
Mechanisms of soldering and brazing
T Takemoto, Osaka University, Japan
- Introduction
- Definition of soldering and brazing
- Basic metallurgical reaction during soldering and brazing
- Materials for solders and brazing
- Soldering and brazing process
- Summary and future trends
Mechanisms of fusion microwelding
G A Knorovsky, Sandia National Laboratories and VV Semak, Pennsylvania State University, USA
- Introduction
- Fundamental aspects
- Forces acting on the pool
- Practical aspects
- Some problems in applying micro fusion joining
- Examples: laser, arc and resistance welding
- Summary and conclusions
- Acknowledgements
- References
Modelling of solid-state bonding
Y Takahashi, Osaka University, Japan
- Introduction
- Viscoplastic deformation model and interfacial deformation
- Thermocompression bonding
- Thermosonic bonding
- Numerical simulation of lap resistance welding
- Conclusive remarks
- References
Modelling of fusion microwelding
B Chang, Tsinghua University, China
- Introduction
- Features of thermal process in fusion microwelding
- Modelling of conductive heat transfer
- Modelling of convective heat transfer
- Modelling of resistance microwelding
- Summary and future trends
- Acknowledgements
- References
Sensing, monitoring and control
M Mayer, University of Waterloo, Canada
- Introduction
- Definitions and methods
- Signals from joining processes
- Applications
- Future trends
- References
Assembly process automation and materials handling
Y M Cheung and D Liu, ASM Assembly Automation Ltd, Hong Kong
- Introduction
- Assembly equipments for in-line process
- Material handling in assembly equipment
- Control of process parameters for assembly processes
- Case study: design a customized assembly equipment - an alignment laser welder for fibre pigtailed TO-can laser diode package
- Future trends
- References
PART 2 MICROJOINING AND NANOJOINING PROCESSES
Microelectronics wire bonding
I Lum, M Mayer and Y Zhou, University of Waterloo, Canada
- Introduction
- Wire bonding process
- Process parameters
- Mechanisms of bond formation
- Quality control
- Equipment and fixturing
- Current directions
- References
Solid-state diffusion bonding
A Shirzadi, University of Cambridge, UK
- Basic definition
- Solid-state bonding in comparison with other joining methods
- Main bonding parameters and apparatus
- Theoretical aspects and modelling of solid-state diffusion bonding
- Various approaches to overcome surface oxide problem
- Non-chemical surface oxide removal using liquid gallium
- Summary
Bonding using nanoparticles
A Hirose, Osaka University, Japan and K F Kobayashi, Fukui University of Technology, Japan
- Introduction
- Structure and thermal characteristics of composite Ag nanoparticle
- Bonding of various metals using composite Ag nanoparticle
- Effects of bonding conditions on bondability of Cu-to-Cu joints
- Bonding of Si chip
- Conclusion and future trends
- References
Diffusion soldering and brazing
M L Kuntz and Y Zhou, University of Waterloo, Canada
- Introduction to diffusion soldering/brazing
- Process description of diffusion soldering/brazing
- Diffusion soldering/brazing process mechanics
- Evaluating joint properties
- Modeling of diffusion soldering/brazing
- Summary and future trends
- References
Laser soldering
Y Tian, Harbin Institute of Technology, China
- Introduction
- Overview of laser soldering
- Fundamentals of laser soldering
- Fluxless laser soldering
- Reliability of solder joint
- Summary and future trends
- Acknowledgment
- References
Fluxless soldering
J P Jung University of Seoul, Korea and S M Hong, Samsung Electron Co. Ltd., Korea
- Flux in Soldering
- Demand for fluxless soldering
- Fluxless soldering process
- Summary
Laser microwelding
I Miyamoto, Osaka University Japan and G A Knorovsky, Sandia National Laboratories, USA
- Introduction
- Fundamentals of laser micro welding
- Thermal modeling of laser microwelding
- Weld defects
- Laser microwelding technologies
- Evaluation of micro weld joints
- Applications of laser microwelding
- Novel laser microwelding technologies
- Future trends
- Acknowledgements
- Bibliography
- Equation annex
Electron beam microwelding
G A Knorovsky, Sandia National Laboratories, USA, T Dorfmüller, U
Dilthey and K Woeste, RWTH - Aachen University, Germany
- Introduction
- Technology
- Microwelding process
- Examples of joining and applications
- Summary
- Acknowledgements
- References
Resistance microwelding
S Fukumoto, University of Hyogo, Japan Y Zhou, University of Waterloo, Canada and W Tan
- Introduction
- Fundamentals
- Process variations
- Process conditions: Welding parameters
- Process conditions: Surface
- Dynamic resistance and process control
- Equipment
- Summary and future trends
- References
Adhesive bonding
I S Böhm, E. Stammen, G Hemken, M Wagner, Technical University Braunschweig, Germany
- Introduction
- Adhesive bonding as joining technology
- Adhesive bonding process: pre treatment
- Dispensing and mixing of adhesives
- Curing and setting of adhesives
- Quality control
- Principles of adhesive selection and examples of applications
- Microelectronic interconnections and packaging
- Other applications of adhesive bonding
- Future trends
- Appendix
- References
Introduction to nanojoining
S Sahin, M Yavuz and Y N Zhou, University of Waterloo, Canada
- Introduction
- Nano-joining methods
- Joining by electron beam nano-welding
- Joining by resistance nano-welding
- Joining by ultrasonic nano-welding
- Joining by laser nano-welding
- Summary & future trends
- References
PART 3 MICROJOINING OF MATERIALS AND APPLICATIONS OF MICROJOINING
Joining of high temperature superconductors
G Zou, Tsinghua University, China
- Introduction
- Superconducting materials
- Processing technologies of high temperature superconductors
- Needs for joining high temperature superconductors
- Joining of BSCCO bulks
- Soldering of BSCCO tapes
- Diffusion bonding of BSCCO tapes
- Joining of YBCO bulks
- Conclusion and future trends
- Acknowledgements
- References
Joining of shape memory alloys
K Uenishi and K F Kobayashi, Osaka University, Japan
- Introduction
- Basics of shape memory alloys
- Application of SMAs
- Background on welding and laser processing of SMA
- Brazing of nithinol
- Laser microwelding
- Future trends
- References
Wafer bonding
J Wei and Z Sun, Singapore Institute of Manufacturing Technology, Singapore
- Introduction
- Direct wafer bonding
- Anodic wafer bonding
- Wafer bonding via intermediate layers
- Bonding of dissimilar materials
- Concluding remarks
- References
Plastics microwelding
I Jones, TWI Ltd, UK
- Introduction
- Theory of welding plastics
- Introduction to welding processes
- Introduction to processes for microwelding of plastics
- Ultrasonic welding
- Laser welding
- Future trends
- References
Microjoining in medical components and devices
K J Ely, GlaxoSmithKline, USA and Y N Zhou, University of Waterloo, Canada
- Introduction
- Materials challenges
- Medical components and devices
- Joint design and process selection
- Testing and verification
- Summary and future trends
- References
Hermetic sealing of solid oxide fuel cells
M Brochu, McGill University, Canada and RE Loehman, Sandia National Laboratories, USA
- Introduction
- Materials involved in the fabrication of a SOFC
- Different approaches for sealing SOFCs
- Summary
- References
Joining of bulk nanostructured materials
M Brochu, McGill University, Canada
- Introduction
- Fabrication processes
- Non-equilibrium state of microstructure
- Attempts in joining bulk nanomaterials
- Metallic glasses
- Summary
- References
Ceramic/metal bonding
A Wu, Tsinghua University, China
- Introduction
- Characteristics of the typical ceramic materials
- General difficulties in the joining of ceramic/metal
- Brazing ceramics to metal
- Vacuum diffusion bonding
- Typical applications
- Summary and future trends
- References