This item is in: Materials > Electronic and optical materials > Electronic materials and technology
Advanced adhesives in electronics: Materials, properties and applicationsEdited by M O Alam and C Bailey, University of Greenwich, UK
Woodhead Publishing Series in Electronic and Optical Materials No. 19
- reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications
- provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems
- focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.
The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.
With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.
ISBN 1 84569 576 3
ISBN-13: 978 1 84569 576 7
May 2011
280 pages 234 x 156mm hardback
£125.00 / US$210.00 / €150.00
Usually dispatched within 24 hours
About the editors
M. O. Alam is a Researcher and Christopher Bailey is a Professor in the School of Computing and Mathematical Sciences at the University of Greenwich, UK.
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Contents
PART 1 TYPES OF ADHESIVE
PART 1 TYPES OF ADHESIVE
PART 2 PROCESSING AND PROPERTIES
PART 2 PROCESSING AND PROPERTIES
Introduction to adhesive joining technology for electronics
M O Alam and C Bailey, University of Greenwich, UK
- Introduction
- Classification of adhesives used in electronic packaging
- A brief overview of electronic assemblies
- Typical uses of advanced adhesives in electronics
- References
PART 1 TYPES OF ADHESIVE
PART 1 TYPES OF ADHESIVE
Thermally conductive adhesives in electronics
J Felba, Wroclaw University of Technology, Poland
- Introduction
- Model of heat conductance
- Heat transport in thermally conductive adhesives
- Thermally conductive fillers
- Role of polymer base materials
- Thermal conductivity of adhesives and methods of its measurement
- Conclusions
- References
Thermally conductive adhesives in electronics
J Felba, Wroclaw University of Technology, Poland
- Introduction
- Model of heat conductance
- Heat transport in thermally conductive adhesives
- Thermally conductive fillers
- Role of polymer base materials
- Thermal conductivity of adhesives and methods of its measurement
- Conclusions
- References
Anisotropic conductive adhesives in electronics
J W C de Vries and J F J M Caers, Philips Applied Technologies, The Netherlands
- Introduction
- Nature of adhesive bond
- Materials and processing
- Critical loading
- Evaluation methods
- Case studies
- Conclusion
- Acknowledgements
- References
- Appendix: list of abbreviations
Anisotropic conductive adhesives in electronics
J W C de Vries and J F J M Caers, Philips Applied Technologies, The Netherlands
- Introduction
- Nature of adhesive bond
- Materials and processing
- Critical loading
- Evaluation methods
- Case studies
- Conclusion
- Acknowledgements
- References
- Appendix: list of abbreviations
Isotropic conductive adhesives in electronics
J E Morris, Portland State University, USA
- Introduction
- General isotropic conductive adhesive (ICA) properties
- Reliability
- Modeling
- Nanotechnologies in ICAs
- Conclusion
- References
Isotropic conductive adhesives in electronics
J E Morris, Portland State University, USA
- Introduction
- General isotropic conductive adhesive (ICA) properties
- Reliability
- Modeling
- Nanotechnologies in ICAs
- Conclusion
- References
Underfill adhesive materials for flip chip applications
Q K Tong, Henkel Corporation, USA
- Introduction: flip chip and direct chip attachment technology
- Advantages of direct chip attachment technology
- Reliability challenge of flip chip technology
- Advances in the flip chip underfill process and encapsulant materials
- New material challenges to lead-free solder
- Material requirements for wafer level underfill
- Wafer level dual encapsulation process
- Conclusion
- References
Underfill adhesive materials for flip chip applications
Q K Tong, Henkel Corporation, USA
- Introduction: flip chip and direct chip attachment technology
- Advantages of direct chip attachment technology
- Reliability challenge of flip chip technology
- Advances in the flip chip underfill process and encapsulant materials
- New material challenges to lead-free solder
- Material requirements for wafer level underfill
- Wafer level dual encapsulation process
- Conclusion
- References
PART 2 PROCESSING AND PROPERTIES
PART 2 PROCESSING AND PROPERTIES
Structural integrity of metal-polymer adhesive interfaces in microelectronics
M Inoue, Osaka University, Japan
- Introduction
- Theoretical considerations of work of fracture and bonding strength of adhesive joints
- Chemical and physical intermolecular interactions at interfaces
- Other influential factors determining bond strength of real adhesive joints
- Effect of environmental factors
- Interconnections using electrically conductive adhesives
- Conclusion
- References
Structural integrity of metal-polymer adhesive interfaces in microelectronics
M Inoue, Osaka University, Japan
- Introduction
- Theoretical considerations of work of fracture and bonding strength of adhesive joints
- Chemical and physical intermolecular interactions at interfaces
- Other influential factors determining bond strength of real adhesive joints
- Effect of environmental factors
- Interconnections using electrically conductive adhesives
- Conclusion
- References
Modelling techniques used to assess conductive adhesive properties
C Bailey, University of Greenwich, UK
- Introduction
- Numerical modelling technologies
- Modelling applied to packaging processes
- Modelling the performance of adhesives
- Future trends
- Conclusions
- References
Modelling techniques used to assess conductive adhesive properties
C Bailey, University of Greenwich, UK
- Introduction
- Numerical modelling technologies
- Modelling applied to packaging processes
- Modelling the performance of adhesives
- Future trends
- Conclusions
- References
Adhesive technology for photonics
M A Uddin and H P Chan, City University of Hong Kong, Hong Kong
- Introduction
- The major characteristics of adhesives for photonic applications
- Types of adhesive used in photonics
- Major applications of adhesive in photonics
- Adhesive for photonic packaging
- Adhesive used in photonic devices
- Typical challenges in reliable fabrication
- Conclusions
- References
Adhesive technology for photonics
M A Uddin and H P Chan, City University of Hong Kong, Hong Kong
- Introduction
- The major characteristics of adhesives for photonic applications
- Types of adhesive used in photonics
- Major applications of adhesive in photonics
- Adhesive for photonic packaging
- Adhesive used in photonic devices
- Typical challenges in reliable fabrication
- Conclusions
- References